Job Information
Intel Hybrid Bond Interconnects Wafer Assembly TD Engineer in Topeka, Kansas
Job Description
Are you interested in being part of Intel's strategy to advance Moore's law for the next 50 years? Are you passionate about your personal growth and Intel's culture initiatives? Then Wafer Level Assembly Technology Development (WATD) team is the place for you.
We are looking for passionate engineers who are looking to help grow our team into the premiere advanced packaging site in the world.
As the needs for the worlds compute capabilities have evolved and grown, advanced packaging has become a critical part of the semiconductor industry roadmap. Wafer Assembly Technology Development (WATD), a part of Assembly and Test Technology Development (ATTD), is at the center of Intel's advanced packaging technology development. We are enabling next gen disaggregated xPU architectures bringing 2.5D and 3D integrated circuit packaging techniques such as Foveros, EMIB and Hybrid Bonding (HBI) to life. Wafer Level Assembly Technology Development group develops and integrates novel equipment, processes, and manufacturing operations to empower innovative products based on chiplet designs.
Responsibilities may include, but not be limited to:
-Role model safety, producing an injury free environment.
Lead equipment development projects, including the selection of first-of-a-kind wafer level packaging technologies.
Developing new toolsets into HVM solutions compatible with Industry 4.0 standards.
Maintain equipment manufacturability within a technology development environment.
Driving robust integrated flow solutions.
Applying principles for design of experiments and data analysis.
Defining strategies to drive solutions to a wide range of theoretical and practical problems.
Conducts tests and research on basic materials and properties.
Provides consultation concerning packaging problems and improvements in the packaging process.
Candidates must possess the following behavioral traits/skills:
Be inclusive, breaking down silos and developing solutions that push the boundaries of technical innovation.
Driving the One Intel culture.
Be willing to learn and build on what Intel has already accomplished.
Collaborate with our partners to drive projects to completion.
A proactive nature, solving problems before they become a real problem.
Producing a quality first environment.
A passion for growth and development, not only yourself but others around you and the organization.
Willingness to be open and communicate issues.
Desire to bring your full self to Intel, integrating your culture into ours.
Be able to apply program management principles to thrive in a complex environment with many unknown variables.
What we offer:
We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. As a global leader in innovation and new technology, we foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We offer a competitive salary and financial benefits such as bonuses, life and disability insurance, opportunities to buy Intel stock at a discounted rate, and Intel stock awards (eligibility at the discretion of Intel Corporation). We provide benefits that promote a healthy, enjoyable life: excellent medical plans, wellness programs, and amenities, time off, recreational activities, discounts on various products and services, and much more creative perks that make Intel a Great Place to Work.
Qualifications
For information on Intel’s immigration sponsorship guidelines, please see Intel U.S. Immigration Sponsorship Information (https://www.intel.com/content/www/us/en/jobs/hiring.html) .
You must possess the below requirements to be initially considered for this position.
Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained through a combination of your schoolwork and/or classes and/or research and/or relevant previous job and/or internship experiences.
Minimum Qualifications:
Must possess bachelor's degree with 4+ years of relevant experience OR
Master's degree with 2+ years of relevant experience OR
PhD degree with 2+ years of relevant experience in Si process/semiconductor packaging assembly technology development.
Preferred Qualifications:
4+ years of experience with a PhD degree or 6+ years of experience with a masters degree in: SI process/semiconductor packaging assembly technology development.
Direct technology development experience is a plus.
Direct supplier management experience is a plus.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Covid Statement
Intel strongly encourages employees to be vaccinated against COVID-19. Intel aligns to federal, state, and local laws and as a contractor to the U.S. Government is subject to government mandates that may be issued. Intel policies for COVID-19 including guidance about testing and vaccination are subject to change over time.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here: https://www.intel.com/content/www/us/en/jobs/benefits.html
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.